1.8 mm ultra‑low slim body for space‑saving installation.
Optional left‑/right‑rotating airflow to suppress workpiece rotation and jitter.
Cyclone negative‑pressure principle enables full‑contact‑free levitation of workpieces.
Maximum adsorption gap up to 10 mm, compatible with various thin‑light, coated and air‑permeable plates.
No additional generator required; direct connection to compressed air.

Suitable for handling fragile and sensitive workpieces, such as silicon wafers and battery sheets.
Suitable for handling air‑permeable workpieces, such as printed circuit boards and PVC boards.
Suitable for separating thin‑light workpieces, such as plastic films and papers.
Suitable for optical and glass materials, such as ultra‑thin tempered glass, display substrates and backlight lenses.