When the vacuum is applied, the suction cup installed on the lifting cylinder quickly extends with the cylinder piston, and automatically rises and falls and maintains the suction state after contacting the sucked object.
The cycle is short, controlled by a single vacuum throttle valve, automatically compensates for the height of the sucked object, the piston does not rotate, and the operation is simple.

Used to suction machined, press-molded or hot-formed objects and can also be used to separate paper or plastic, steel plates.
For example, silicon wafer handling, IC cards, manuals, etc.